Lead-free alloy containing tin, silver and indium

Details Lead-free alloy containing tin, silver and indium Lead-free alloy containing tin, silver and indium

1992-05-04

1993-10-26

Yee, Deborah

Alloys or metallic compositions

Tin base

21914622, C22C 1300

Patent

active

052563707

ABSTRACT:
A low melting point solder alloy comprising effective amounts of tin, silver and indium.

REFERENCES:
patent: 1565115 (1925-12-01), Buckner et al.
patent: 1934730 (1933-11-01), Murray et al.
patent: 2157933 (1939-05-01), Hensel et al.
patent: 2306667 (1942-12-01), Smith
patent: 2464821 (1949-03-01), Ludwick et al.
patent: 2532265 (1950-11-01), Zickrick
patent: 2623273 (1952-12-01), Murray et al.
patent: 3184303 (1965-05-01), Grobin
patent: 3503721 (1970-03-01), Lupfer
patent: 3627517 (1971-12-01), Ibscher
patent: 3833362 (1974-09-01), Postupack
patent: 4268585 (1981-05-01), Daur et al.
patent: 4670217 (1987-06-01), Henson et al.
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 4806309 (1989-02-01), Tulman
patent: 4879096 (1989-11-01), Naton
patent: 5052489 (1991-10-01), Carisella et al.
Rhines et al., Constitution of the System Indium-Tin, pp. 1-20, Paper Presented at the 28th Annual Convention of the American Society for Metals (1946).
Ludwick, Indium, pp. 21-151, The Indium Corporation of America (1959).
Manko, Solders and Soldering, pp. 115-123, McGraw Hill Book Company (2nd ed. 1979).
Assembly Joining Handbook, Low Melting Temperature Solders, The Institute for Interconnecting and Packaging Electronic Circuits (Dec. 1983).
The Indium Corporation of America, Indalloy Specialty Solders & Alloys (1988).
The Indium Corporation of America, Indalloy Fusible Alloys (1988).
Federal Specification, Solder; Tin Alloy, Tin-Lead Alloy, and Lead Alloy, QQ-S-571E (Interim Amendment 5 (ER) 28 Dec. 1989).
Stevens & White, Properties and Selection: Indium and Bismuth, Metals Handbook, vol. 2 (10th ed. 1990).
Soldering of Electronic Products, Lead Industries Association Inc. (1991).

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