Lead-free alloy containing tin, silver and indium

Details Lead-free alloy containing tin, silver and indium Lead-free alloy containing tin, silver and indium

1994-11-04

1996-12-03

Yee, Deborah

Alloys or metallic compositions

Tin base

21914622, C22C 1300

Patent

active

055805205

ABSTRACT:
A low melting point solder alloy comprising effective amounts of tin, silver and indium.

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Rhines et al., Constitution of the System Indium-Tin, pp. 1-20, Paper Presented at the 28th Annual Convention of the American Society for Metals (1946).
Ludwick, Indium, pp. 21-151, The Indium Corporation of America (1959).
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Anikeev et al., Improving the Brazeability of Steel with Siliconized Graphite by Alloying the Tin-Copper-Silver Brazing Alloy with Indium, 2390 Welding Production vol. 28 (1981) Mar., No. 3, Cambridge Great Britain, pp. 24-36.
Andreeva et al., Solder for Soldering Components of Electrovacuum Devices, Chemical Abstracts, vol. 91, No. 14, Abstract No. 111344 (May 30, 1979).
Assembly Joining Handbook: 4.2.1 Low Melting Temperature Solders, the Institute for Interconnecting and Packaging Electronic Circuits, pp. 1-4 (Dec., 1983).
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Ludwick, Indium, The Indium Corporation of America, pp. 21-151 (1950).
Manko, Solders and Soldering: 3-25 Intermediate-Temperature Indium Base Solders, pp. 115-123, McGraw Hill Book Company (2nd ed. 1979).
Rhines et al., Constitution of the System Indium-Tin, Paper Presented at the 28th Annual Convention of the American Society for Metals, pp. 1-20 (1946).
Soldering of Electronic Products, Lead Industries Association Inc., pp. 2-17 (1991).
Stevens & White, Properties and Selection: Indium and Bismuth, Metals Handbook vol. 2, pp. 750-757 (10th ed. 1990).
The Indium Corporation Of America, Indalloy Specialty Solders and Alloys, pp. 1-17.
The Indium Corporation of America, Indalloy Fusible Alloys, pp. 1-5 (1988).

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