Lead-free alloy

Details Lead-free alloy Lead-free alloy

2005-08-30

2005-08-30

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

C420S560000, C420S561000, C420S562000, C148S400000

Reexamination Certificate

active

06936219

ABSTRACT:
Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt. %. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder paste, thin sheet, ribbon foil, perform etc. The alloy has improved mechanical and electrical properties in comparison with conventional Tin-Lead alloys Sn9Zn and 63Sn37Pb.

REFERENCES:
patent: 2252409 (1941-08-01), Riesmeyer
patent: 6207035 (2001-03-01), Adler et al.
patent: 200015478 (2000-01-01), None
patent: 2000015478 (2000-01-01), None
Wei Xiu-Qin, Huang Kui-Zhen, Zhou Lang, Effect of Microalloying on Wettability of Sn-9Zn Lead-free Solder, Electronic Components & Materials, Nov. 2003, p. 38-39, vol. 22 No. 11.
Masayuki Kitajima, Tadaaki Shono, Takehisa Ogino, et al., SnZnAl Lead Free Solder With Suppressed Oxidation Reaction, IPC/Soldertec Lead-Free Conference, Jun. 2003, 6 pages.

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