Lead frames with improved adhesion to a polymer

Details Lead frames with improved adhesion to a polymer Lead frames with improved adhesion to a polymer

1994-07-01

1995-09-12

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257766, 257666, 257736, H01L 23043, H01L 2348, H01L 2354

Patent

active

054499518

ABSTRACT:
There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

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