Lead frames for use in plastic mold type semiconductor devices

Details Lead frames for use in plastic mold type semiconductor devices Lead frames for use in plastic mold type semiconductor devices

1991-03-28

1992-10-06

Gonzalez, Frank

357 72, H01L 2960

Patent

active

051537060

ABSTRACT:
In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.

REFERENCES:
patent: 4855807 (1989-08-01), Yamaji et al.
patent: 4942455 (1990-07-01), Shinohara
patent: 5072283 (1991-12-01), Bolger

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