Lead frame with lead-securing tape bonded to the inner lead sect

Details Lead frame with lead-securing tape bonded to the inner lead sect Lead frame with lead-securing tape bonded to the inner lead sect

1999-03-15

2000-03-28

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

257695, H01L 2144, H01L 2148, H01L 2150, H01L 23495

Patent

active

060431083

ABSTRACT:
A lead frame comprises an island supported by island supports at its four corners and leads extending from its frame section to the island. The leads are composed of inner leads and outer leads which are connected to each other with dam bars. Plating layers are formed on the surfaces of the tip sections of the inner leads, and lead-fixing tape is bonded to the distal portions of the inner leads with an adhesive which acquires elastic properties when set. The lead-fixing tape is bonded with its inner side located 0.1 mm-2 mm inward from the tips of the inner leads.

REFERENCES:
patent: 5637913 (1997-06-01), Kajihara

Affiliated with

Also associated with

Rating

Lead frame with lead-securing tape bonded to the inner lead sect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame with lead-securing tape bonded to the inner lead sect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame with lead-securing tape bonded to the inner lead sect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1325427