Lead frame with die bond flag for ceramic packages

Details Lead frame with die bond flag for ceramic packages Lead frame with die bond flag for ceramic packages

1987-10-05

1989-05-09

James, Andrew J.

Fishing, trapping, and vermin destroying

357 80, 437217, H01L 2348

Patent

active

048293628

ABSTRACT:
A lead frame having a central die bond flag for ceramic integrated circuit die packages. The direct connection of the die bond flag to the lead frame via one or more leads permits direct connection of the back side or substrate of an integrated circuit die to a lead while eliminating dedicated supports that provide physical support but no electrical lead function. In a particular embodiment of the invention, a lead frame is provided whereby any of the leads may be chosen to serve as the die bond flag support/lead combination, whereby the rest of the leads are severed from connection with the die bond flag.

REFERENCES:
patent: 4413404 (1983-11-01), Burns
patent: 4471158 (1984-09-01), Roberts
patent: 4514750 (1985-04-01), Adams
patent: 4523371 (1985-06-01), Wakashima
patent: 4527185 (1985-07-01), Philofsky
patent: 4534105 (1985-08-01), Reusch
patent: 4587548 (1986-05-01), Grabbe et al.

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