Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1992-09-18
1994-10-25
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257673, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
053592239
ABSTRACT:
There is provided a lead frame structure used in a semiconductor device which is fabricated by a tape carrier bonding method. The lead frame structure has a convex portion at its top portion which is subjected to a thermal compression with a bonding tool. The convex portion may be formed by bending the top portion of the lead frame toward the bonding tool side up to an angle of at least approximately 90 degrees. When the bonding tool compresses the top portion of the lead frame, the bent portion is compressed and deformed but no damage of the lead frame thereby preventing formations of a depression region and a rapid drop portion in the lead frame, which is defined by an edge of the bonding tool in which the rapid drop portion is likely to cause disconnection of the lead frame during or after the bonding process. The invention permits the lead frame to be free from disconnection by a thermal compression with the bonding tool.
REFERENCES:
patent: 3347442 (1967-10-01), Reber
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3868724 (1975-02-01), Perrino
patent: 4771330 (1988-09-01), Long
patent: 4980753 (1990-12-01), Dunaway et al.
Clark S. V.
Crane Sara W.
NEC Corporation
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