Lead frame used for semiconductor chips of different bit configu

Details Lead frame used for semiconductor chips of different bit configu Lead frame used for semiconductor chips of different bit configu

1997-09-24

2000-08-15

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

438123, H01L 23495, H01L 2150

Patent

active

061040835

ABSTRACT:
The lead frame comprises a plurality of inner leads adhered onto a semiconductor chip by means of adhesive tape provided on the semiconductor chip, and a plurality of outer leads each formed integrally with corresponding one of the inner leads. The plurality of inner leads include an inner lead group having a plurality of inner leads each of which is connected to the corresponding one of electrodes of the semiconductor chips, and the other inner lead group having a plurality of inner leads disconnected from the electrodes of the semiconductor chips and cut off from at least one of the outer leads.

REFERENCES:
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5252854 (1993-10-01), Arita et al.
patent: 5468991 (1995-11-01), Lee et al.
patent: 5812381 (1998-09-01), Shigeta et al.

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