Lead frame terminal

Details Lead frame terminal Lead frame terminal

1978-11-21

1980-07-29

Reynolds, B. A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 16HS, 174 685, 339 17E, 357 80, 357 81, H05K 112

Patent

active

042152356

ABSTRACT:
A terminal stud is mounted upon a lead frame element within a modular circuit package. The lead frame element is affixed to a ceramic substrate through a thick film circuit. The terminal stud includes a cylindrical mounting member supported by the lead frame element and an axially extending, cylindrically shaped projection is snugly located within an opening provided by the lead frame element. A solder layer is sandwiched between the terminal stud and the lead frame element while both the solder and the thick film circuit are reflowed for bonding the terminal stud to the lead frame element and the lead frame element to the ceramic substrate in a single operation.

REFERENCES:
patent: 2991440 (1961-07-01), Kulka
patent: 3958075 (1976-05-01), Kaufman
patent: 4047197 (1977-09-01), Schierz

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