Lead frame taping machine

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

Patent

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Details

156515, 156518, 156520, 156261, B32B 3100

Patent

active

055079105

ABSTRACT:
The object of the present invention is to provide a lead frame taping machine, which is capable of waiting the fade at a position away from a lead frame holding section and preventing the punch from shaking when the tape-chip is taped onto the lead frame. The lead frame taping machine of the present invention comprises: a lead frame holding section for holding a lead frame; a die plate for holding a tape to be punched, the die plate being provided away from the lead frame holding section and having a through punch-hole; a punch being provided away from the die plate, the punch being capable of moving to and away from the lead frame holding section through the through punch-hole whereby the punch is capable of punching the tape and pressing a tape-chip, which has punched off from the tape, onto the lead frame; and a driving mechanism for moving the punch. The die plate is capable of moving between a first position which is separate away from the lead frame holding section and a second position which is close thereto, the die plate is moved to the second position when the punch punches off the tape and presses the tape-chip onto the lead frame.

REFERENCES:
patent: 4581096 (1986-04-01), Sato
patent: 4752351 (1988-06-01), Lunt

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