Lead frame taping apparatus and taping method

Details Lead frame taping apparatus and taping method Lead frame taping apparatus and taping method

1996-10-25

1998-11-10

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156251, 156352, 156362, 156363, 156511, 156515, 156557, B32B 3100

Patent

active

058337830

ABSTRACT:
In a lead frame taping apparatus and a method thereof, a plurality of punching portions are provided and each punching portion concurrently attaches a tape to at least two lead frames. Also, the tape can be continuously attached to the different kinds of a lead frame without the exchange of molds by differing the operation time of each punching portion. Further, a taping detecting sensor is provided to detect the attachment of the tape at the lead frame. Therefore, productivity is increased while saving labor and inferior products can be accurately detected.

REFERENCES:
patent: 4046613 (1977-09-01), Kucheck et al.
patent: 4089728 (1978-05-01), Teed
patent: 4680080 (1987-07-01), Instance
patent: 4685982 (1987-08-01), Kucheck
patent: 4931127 (1990-06-01), Matsumoto
patent: 5055155 (1991-10-01), Crotty et al.

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