Lead frame supplying method

Details Lead frame supplying method Lead frame supplying method

1997-11-18

1999-12-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, 414331, 414417, H01L 2144

Patent

active

060016701

ABSTRACT:
In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.

REFERENCES:
patent: 5741988 (1998-04-01), Kikuchi et al.
patent: 5827035 (1998-10-01), Fuke et al.
patent: 5876766 (1999-03-01), Chou
patent: 5897290 (1999-04-01), Lu et al.
patent: 5903463 (1999-05-01), Seguro et al.

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