Lead frame supplying apparatus

Details Lead frame supplying apparatus Lead frame supplying apparatus

1999-05-04

2000-03-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

414417, 4147906, H01L 2144

Patent

active

060339322

ABSTRACT:
In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.

REFERENCES:
patent: 5827035 (1998-10-01), Fuitie et al.
patent: 5868542 (1999-02-01), Fuke et al.
patent: 5897290 (1999-04-01), Lu et al.
patent: 5915957 (1999-06-01), Tanigawa

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