Lead frame, sensor including lead frame and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S667000, C257S692000, C257SE23031, C257SE23046, C029S827000, C029S857000, C029S592000, C361S807000, C361S813000, C438S123000, C438S127000, C438S048000, C438S050000, C073S493000

Reexamination Certificate

active

07829982

ABSTRACT:
A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.

REFERENCES:
patent: 6212783 (2001-04-01), Ott et al.
patent: 2004/0103530 (2004-06-01), Adachi et al.
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patent: 2002-015204 (2002-01-01), None
patent: 2004-006752 (2004-01-01), None
patent: 2004-077374 (2004-03-01), None
patent: 2004-128473 (2004-04-01), None

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