Lead frame, semiconductor device using the same and method...

Details Lead frame, semiconductor device using the same and method... Lead frame, semiconductor device using the same and method...

2007-03-13

2007-03-13

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S111000, C438S977000, C257S666000

Reexamination Certificate

active

10936795

ABSTRACT:
A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board.

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