Lead frame, semiconductor device, method of manufacturing...

Details Lead frame, semiconductor device, method of manufacturing... Lead frame, semiconductor device, method of manufacturing...

2008-08-12

2011-10-18

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S676000, C257SE23031

Reexamination Certificate

active

08039932

ABSTRACT:
A lead frame is provided which can prevent a short circuit between wires and the ends of adjacent leads, the short circuit being caused by wire sweep during the injection of molding resin, in a configuration where the electrodes of a semiconductor chip and the leads disposed around the semiconductor chip. The lead having sides substantially perpendicular to the direction of a resin flow has an end whose upstream side relative to the resin flow is constricted.

REFERENCES:
patent: 5633205 (1997-05-01), Tsuchiya et al.
patent: 5869355 (1999-02-01), Fukaya
patent: 5939774 (1999-08-01), Yamada
patent: 5955778 (1999-09-01), Shingai
patent: 6396139 (2002-05-01), Huang
patent: 1-133340 (1989-05-01), None
patent: 3-12448 (1991-02-01), None
patent: 6-291236 (1994-10-01), None
patent: 7-202104 (1995-08-01), None
patent: 11-67805 (1999-03-01), None
Kouyama, S. et al, “VLSI Packaging for Logic Device,” vol. 2, NIKKEI BP, Inc., 1993, pp. 165-170.

Affiliated with

Also associated with

Rating

Lead frame, semiconductor device, method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame, semiconductor device, method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame, semiconductor device, method of manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4289247