Lead frame, semiconductor device, and method of...

Details Lead frame, semiconductor device, and method of... Lead frame, semiconductor device, and method of...

2008-09-03

2010-12-28

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S121000

Reexamination Certificate

active

07858447

ABSTRACT:
A lead frame according to one aspect of the present invention is used for a resin-sealed-type semiconductor device and includes a first lead frame having a frame body part and a lead part, and a second lead frame having a frame body part and a lead part. The lead part of the first lead frame and the lead part of the second lead frame do not contact with each other and an inner lead part formed in the lead part of the first lead frame and an inner lead part formed in the lead part of the second lead frame are provided in substantially the same plane when the frame body part of the first lead frame and the frame body part of the second lead frame are laminated together.

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