Lead frame, semiconductor device, and method of...

Details Lead frame, semiconductor device, and method of... Lead frame, semiconductor device, and method of...

2011-05-17

2011-05-17

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23031, C257SE21502, C438S123000

Reexamination Certificate

active

07944027

ABSTRACT:
To solve a problem in that a die processing cost increases when employing a method involving providing a suction hole in the die to fix an island onto a bottom surface, provided is a semiconductor device, which includes: a semiconductor chip, an island having a first surface, on which the semiconductor chip is mounted; and a second surface opposing to the first surface, a hanger pin extended from the island, a branch portion extended from one of the island and the hanger pin, and a resin encapsulating the semiconductor chip, the island, the hanger pin and the brunch portion while exposing the second surface of the island.

REFERENCES:
patent: 2002/0167074 (2002-11-01), Kim
patent: 10-209194 (1998-08-01), None

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