Lead frame preparation for solder dipping

Details Lead frame preparation for solder dipping Lead frame preparation for solder dipping

1986-09-04

1988-09-27

Sneed, H. M. S.

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 38, 228179, 2281801, 29 65, B08B 3000

Patent

active

047739401

ABSTRACT:
Metal leads are prepared for solder dipping by first exposing the leads to a fifty percent solution of sulfuric acid. The leads are then rinsed using city water and exposed to solution consisting of fifty percent sulfuric acid, twenty-five percent nitric acid and twenty-five percent deionized water. The leads are then rinsed sequentially in city water and deionized water. Finally, excess water is removed from the leads.

REFERENCES:
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 4566934 (1986-01-01), Brasen et al.
patent: 4610798 (1986-09-01), Benkus

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