Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1991-03-04
1992-06-09
Valentine, Donald R.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204228, C25D 1700, C25D 1712
Patent
active
051204185
ABSTRACT:
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.
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Kang Sung K.
Palmer Michael J.
Reiley Timothy C.
Topa Robert D.
International Business Machines - Corporation
Morris Daniel P.
Riddles Alvin J.
Valentine Donald R.
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