Lead-frame package with shield means between signal terminal ele

Details Lead-frame package with shield means between signal terminal ele Lead-frame package with shield means between signal terminal ele

1998-03-03

2000-12-26

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

257659, 257662, 257668, 257784, 257698, H01L 2348, H01L 23495

Patent

active

061664294

ABSTRACT:
A semiconductor device has the following structure: a lead frame 2 is disposed on the center of a package 1, signal terminal electrodes 3 through 7 are disposed on edges of the package, a semiconductor chip 8 is mounted on the lead frame 2, a grounding electrode 16 having a grounding potential is disposed between the signal terminal electrodes 4 and 5, and a grounding electrode having a grounding potential is disposed between the signal terminal electrodes 5 and 6. This structure increases an electrical separation between the signal terminal electrodes.

REFERENCES:
patent: 5631809 (1997-05-01), Takagi et al.
patent: 5869898 (1999-02-01), Sato
patent: 5894171 (1999-04-01), Uda

Affiliated with

Also associated with

Rating

Lead-frame package with shield means between signal terminal ele does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-frame package with shield means between signal terminal ele, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-frame package with shield means between signal terminal ele will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-997986