Lead frame, optical coupling part using lead frame, and...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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Details

C385S049000, C385S088000, C257S099000

Reexamination Certificate

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11711862

ABSTRACT:
When a resin59to form a molded body20is poured and a lead frame30is attached to a front end face21of the molded body20by insert molding, protective leads32provided on both outsides of a lead pattern31of the lead frame30moderate the flow of the resin59and the force acting on the lead pattern31is decreased, so that misregistration of the lead pattern31can be prevented. Accordingly, the inserted and molded lead frame30can be wired on the front end face21of the molded body20for easily accomplishing three-dimensional electric wiring.

REFERENCES:
patent: 7301139 (2007-11-01), Sakurai et al.
patent: 2005/0063651 (2005-03-01), Hamasaki et al.
patent: 2005/0169596 (2005-08-01), Hamasaki et al.
patent: 2006/0039658 (2006-02-01), Furuyama et al.
patent: 2006/0291783 (2006-12-01), Hamasaki et al.
patent: 2007/0053637 (2007-03-01), Golwalkar et al.
patent: 2001-159724 (2001-06-01), None
patent: 2005-43622 (2005-02-01), None
U.S. Appl. No. 11/531,922, filed Sep. 14, 2006.

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