Lead frame, manufacturing method of a lead frame, semiconductor

Details Lead frame, manufacturing method of a lead frame, semiconductor Lead frame, manufacturing method of a lead frame, semiconductor

1998-06-30

2000-04-18

Fahmy, Wael

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438122, 438611, 438613, 257692, 257713, 257735, 257737, H01L 2150, H01L 2144, H01L 2348, H01L 2352, H01L 2334

Patent

active

060514507

ABSTRACT:
Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.

REFERENCES:
patent: 5481798 (1996-01-01), Ohsawa
patent: 5786239 (1998-07-01), Ohsawa et al.

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