Lead frame manufacturing method

Details Lead frame manufacturing method Lead frame manufacturing method

1996-04-04

1997-04-08

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 4273766, 4274431, 4274432, B05D 512

Patent

active

056185766

ABSTRACT:
A method for making a lead frame comprising overflow plating the lead frame to form a plating layer thereon; and heating the plated lead frame at a predetermined temperature to rearrange the plating layer. Therefore, the rearrangement of the overflow-plated lead frame, by thermal treatment, effectively eliminates the number of pores formed in the plating layer of the lead frame, thereby greatly reducing the number of corrosive portions.

REFERENCES:
patent: 3934334 (1976-01-01), Hanni
patent: 4188438 (1980-02-01), Burns
patent: 4720396 (1988-01-01), Wood
patent: 4800178 (1989-01-01), Mathew et al.
patent: 5075258 (1991-12-01), Carney et al.
patent: 5454929 (1995-10-01), Kinghorn
patent: 5492266 (1996-02-01), Hoebner et al.
patent: 5510197 (1996-04-01), Takahashi et al.

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