Lead frame, its use in the fabrication of resin-encapsulated sem

Details Lead frame, its use in the fabrication of resin-encapsulated sem Lead frame, its use in the fabrication of resin-encapsulated sem

1996-01-16

1998-11-10

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257670, 257676, H01L 2302

Patent

active

058346910

ABSTRACT:
A lead frame for use in the fabrication of a resin-encapsulated semiconductor device of an LOC structure includes a die pad for receiving a semiconductor chip thereon; a plurality of leads having end portions located along the periphery of the die pad; at least two support bars supporting the die pad; tie bars supporting the plurality of leads; and two frame selvages supporting the tie bars. The die pad, leads, support bars, tie, bars, and frame selvages are formed from a flexible metal sheet as one piece. At least one of the support bars is connected to one of the tie bars or connected to one of the frame selvages in a region adjacent a connection point between the one of the tie bars and the at least one of the frame selvages, the region excluding an orthogonal projection of the die pad.

REFERENCES:
patent: 4527185 (1985-07-01), Philofsky et al.
patent: 4829362 (1989-05-01), Tran et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4912546 (1990-03-01), Fujita
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5162895 (1992-11-01), Takahashi et al.
patent: 5283466 (1994-02-01), Hayashi
patent: 5358906 (1994-10-01), Lee
patent: 5479050 (1995-12-01), Pritchard et al.
patent: 5491360 (1996-02-01), Lin
patent: 5663594 (1997-09-01), Kimura

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