Lead frame incorporating material flow diverters

Details Lead frame incorporating material flow diverters Lead frame incorporating material flow diverters

1997-06-10

1999-07-20

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, 438124, 257667, 257676, H01L 2144, H01L 23495

Patent

active

059266953

ABSTRACT:
Disclosed are methods and apparatuses for manufacturing a semiconductor device package utilizing a lead frame which has one or more encapsulant material flow diverters. The lead frame having material flow diverters includes a multiplicity of leads and at least material flow diverter. The material flow diverter is arranged in such a manner as to control the amount of encapsulant material which is directed both above and below an attached die during the encapsulation process.

REFERENCES:
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5304841 (1994-04-01), Negoro
patent: 5371044 (1994-12-01), Yoshida et al.

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