Lead frame including frame-cutting slit for lead-on-chip (LOC) s

Details Lead frame including frame-cutting slit for lead-on-chip (LOC) s Lead frame including frame-cutting slit for lead-on-chip (LOC) s

1998-03-31

1999-05-04

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 257676, 257787, H01L 2328

Patent

active

059005823

ABSTRACT:
A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

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Shukla et al., "A Critical Review Of VLSI Die-Attachment In High Reliability Applications", Solid State Technology, Jul. 1995, pp. 67-74.

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