Lead frame holding apparatus for use in wire bonders

Details Lead frame holding apparatus for use in wire bonders Lead frame holding apparatus for use in wire bonders

1992-02-14

1993-01-26

Seidel, Richard K.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

219 5621, 228 47, B23K 3700

Patent

active

051816466

ABSTRACT:
A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer raising-and-lowering cam and a downward movement of the heater block and frame retainer via a spring force. When the heater block is raised and approaches its upper limit position, the frame retainer is raised by this upward motion of the heater block, thus positioning the lead frame at a standard bonding level.

REFERENCES:
patent: 4550871 (1985-11-01), Chan et al.
patent: 4575602 (1986-03-01), Sakurai
patent: 4789095 (1988-12-01), Kobayashi

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