Lead frame having polymer coated surface portions

Details Lead frame having polymer coated surface portions Lead frame having polymer coated surface portions

1990-09-10

1992-06-16

Hille, Rolf

357 72, H01L 2314, H01L 2350

Patent

active

051228580

ABSTRACT:
A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.

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