Patent
1986-02-20
1988-08-30
James, Andrew J.
357 80, 357 68, H01L 2348, H01L 2314
Patent
active
047680776
ABSTRACT:
The present invention is directed to a lead frame having both electrically conductive and electrically non-conductive tie-bar portions. The electrically conductive tie-bar portion allows the attached leads to be simultaneously electroplated, yet is removable from the lead frame, leaving the electrically non-conductive tie-bar portion which provides support for the leads. The advantages to the electrically non-conductive tie-bar portion include substantially decreasing the leads' bending and/or breaking from the package, during both manufacturing and/or testing of the integrated circuit.
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Grechus et al-"Lead Frame Bonding"-Western Electric Technical Digest-Apr. 1975, No. 38, pp. 13-14.
Aegis, Inc.
Clark S. V.
James Andrew J.
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