Patent
1990-11-26
1992-03-03
Hille, Rolf
357 68, H01L 2312, H01L 2168
Patent
active
050937090
ABSTRACT:
A lead frame for use in a molding process of supplying an epoxy resin through a runner and a gate into a cavity formed in the lead frame, is disclosed. The lead frame comprises a first and a second side rail and a plurality of leads extending therefrom formed between the first and the second side rails. The first and the second side rails further include an end diagonally terminating at a point which is distally positioned relative to said cavity such that in use said diagonally terminating ends prevents the formation of an epoxy resin flash coating on a lead surface 7 existing between said runner 5Y and each lead 8 of said plurality of leads 8N during the molding process.
Clark S. V.
Hille Rolf
Hyundai Electronics Industries Co,. Ltd.
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