Lead frame having a detachable and interchangeable die-attach pa

Details Lead frame having a detachable and interchangeable die-attach pa Lead frame having a detachable and interchangeable die-attach pa

1996-06-04

1998-10-20

Bray, W. Donald

Metal working

Method of mechanical manufacture

Electrical device making

29855, 29877, 257675, 257698, 437217, 437902, H01R 4300

Patent

active

058228489

ABSTRACT:
A method of detachably mounting a heat sink to a lead frame and then an IC die to the heat sink including the steps of first providing a lead frame that has lead fingers and a multiplicity of tie bars extending inwardly from the lead frame, each tie bar has a fixed end integral with the lead frame and a free end equipped with an attachment means, and then providing a heat sink that has a multiplicity of receptacle means adapted to receive the attachment means on the tie bars as well as at least one opening through the thickness of the heat sink, and detachably engaging the attachment means on the tie bars to the receptacle means on the heat sink. The invention is also directed to a lead frame/heat sink assembly that may have a single IC die or a multiple of IC dies mounted on top of the heat sink. A single IC die or a multiple of IC dies that are mounted to the heat sink can be tested in a KGD or KGS test before being assembled to a lead frame. The heat sink which has at least one opening through its thickness provides both enhanced thermal performance when compared to a conventional heat sink and improved adhesive between the heat sink and a subsequently applied encapsulating compound.

REFERENCES:
patent: 5091341 (1992-02-01), Asada et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5202288 (1993-04-01), Doering et al.
patent: 5387554 (1995-02-01), Liang
patent: 5442234 (1995-08-01), Liang
patent: 5570272 (1996-10-01), Variot

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