Lead-frame forming material

Details Lead-frame forming material Lead-frame forming material

1995-03-14

1997-06-24

Zirker, Daniel

Stock material or miscellaneous articles

Composite

Of metal

428463, 428901, G03F 716, G03F 700, H01L 2148

Patent

active

056415770

ABSTRACT:
Disclosed are i) a lead-frame forming material which contains a light-sensitive material comprising (1) a diazo salt light-sensitive resin and (2) a water-insoluble but alkaline water-soluble lipophilic high molecular weight compound, ii) a lead-frame forming material which contains a light-sensitive material comprising a photodimeric light-sensitive composition, and iii) a lead-frame forming material which contains a light-sensitive material comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing at least one crosslinkable group by the action of the acid.

REFERENCES:
patent: 3698620 (1972-10-01), Geyer et al.
patent: 4342151 (1982-08-01), Guild
patent: 4827118 (1989-05-01), Shibata et al.
patent: 5098814 (1992-03-01), Tunney et al.
Research Disclosure, vol. 185, No. 1, Sep. 1979 Havant GB, pp. 523-526, J.R. Guild `Blank and process for the formation of beam leads for IC bonding` Disclosure Nr. 18570.
Patent Abstracts of Japan, vol. 016, No. 540 (P-1450), 10 Nov. 1992 for JP-A-4-205656.
Patent Abstracts of Japan, vol. 013, No. 098 (P-840), 8 Mar. 1989 for JP-A-63-279256.
Patent Abstracts of Japan, vol. 011, No. 390 (E-567), 19 Dec. 1987 for JP-A-62-154766.
Research Disclosure, vol. 180, No. 0, Apr. 1979 Havant GB, p. 161 AN. `A light-sensitive material having a matting layer`.

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