Lead frame for semiconductor package and method of...

Details Lead frame for semiconductor package and method of... Lead frame for semiconductor package and method of...

2008-03-11

2008-03-11

Malsawma, Lex (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C257S666000, C257SE23034

Reexamination Certificate

active

10923454

ABSTRACT:
Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.

REFERENCES:
patent: 6700192 (2004-03-01), Matsuzawa et al.
patent: 6875630 (2005-04-01), Kasahara et al.
patent: 2002/0153596 (2002-10-01), Tsubosaki et al.
patent: 2004/0140039 (2004-07-01), Yamamoto

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