Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2007-10-23
2007-10-23
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S677000, C257S736000, C257SE23054
Reexamination Certificate
active
11194285
ABSTRACT:
A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufacturing the lead frame are provided. The lead frame includes a base metal layer formed of a metal and a plurality of plating layers having different components formed on at least a surface of the base metal layer, wherein the plating layers include, a Ni plating layer deposited on at least a surface of the base metal layer and formed of Ni or an Ni alloy, a Pd plating layer stacked on at least a surface of the Ni plating layer and formed of Pd or a Pd alloy, and a protection plating layer stacked on at least a surface of the Pd plating layer and formed of Au or an Au alloy, wherein the Ni plating layer is formed to have a predetermined a thickness and a surface coarseness.
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Kang Sung-il
Park Se-chuel
Drinker Biddle & Reath LLP
Parekh Nitin
Samsung Techwin Co. Ltd.
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