Lead frame for semiconductor package

Details Lead frame for semiconductor package Lead frame for semiconductor package

2007-10-23

2007-10-23

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S677000, C257S736000, C257SE23054

Reexamination Certificate

active

11194285

ABSTRACT:
A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufacturing the lead frame are provided. The lead frame includes a base metal layer formed of a metal and a plurality of plating layers having different components formed on at least a surface of the base metal layer, wherein the plating layers include, a Ni plating layer deposited on at least a surface of the base metal layer and formed of Ni or an Ni alloy, a Pd plating layer stacked on at least a surface of the Ni plating layer and formed of Pd or a Pd alloy, and a protection plating layer stacked on at least a surface of the Pd plating layer and formed of Au or an Au alloy, wherein the Ni plating layer is formed to have a predetermined a thickness and a surface coarseness.

REFERENCES:
patent: 5767574 (1998-06-01), Kim et al.
patent: 5801436 (1998-09-01), Serizawa
patent: 5958607 (1999-09-01), Kim et al.
patent: 5977620 (1999-11-01), Kim et al.
patent: 5994767 (1999-11-01), Huang et al.
patent: 6087714 (2000-07-01), Kubara et al.
patent: 6150711 (2000-11-01), Kom et al.
patent: 6150713 (2000-11-01), Park et al.
patent: 6469386 (2002-10-01), Lee et al.
patent: 6917098 (2005-07-01), Yamunan
patent: 2004/0140539 (2004-07-01), Abbott
patent: 59-168659 (1984-09-01), None
patent: 05-315511 (1991-11-01), None
patent: 10-321661 (1998-12-01), None
patent: 2000-124361 (2000-04-01), None
patent: 2002-246534 (2002-08-01), None

Affiliated with

Also associated with

Rating

Lead frame for semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame for semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3884359