Lead frame for semiconductor devices

Details Lead frame for semiconductor devices Lead frame for semiconductor devices

1986-06-12

1988-01-26

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428450, 428458, 156329, H01L 2350, B32B 1508, C09J 312, C09J 506

Patent

active

047219947

ABSTRACT:
This invention provides a semiconductor device lead frame comprising a mounting tab for a semiconductor chip located within the lead frame and multiple inner leads extending to the area adjacent to the perimeter of the tab. The configuration of the inner leads with respect to one another and the mounting tab is stabilized by adhering at least a portion of the leads and, optionally, the mounting tab to a dielectric film coated on one side with a cured, heat-activated silicone adhesive.

REFERENCES:
patent: 3763404 (1973-10-01), Aird
patent: 4063993 (1977-12-01), Burns
patent: 4089733 (1978-05-01), Zimmerman
patent: 4204317 (1980-05-01), Winn
patent: 4332844 (1982-06-01), Hamada et al.
patent: 4339486 (1982-07-01), Shimamoto et al.

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