Lead frame for semiconductor device of the resin encapsulation t

Details Lead frame for semiconductor device of the resin encapsulation t Lead frame for semiconductor device of the resin encapsulation t

1991-09-27

1994-02-01

Pascal, Robert J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257670, 257692, 257696, H01L 2348

Patent

active

052834662

ABSTRACT:
A lead frame for a semiconductor device provided with package suspension leads that have one end portion connected to an outer frame and that have the side of the other end portion extending into a resin encapsulation region, and island suspension leads that have one end portion connected to the side portion of the island that does not oppose the outer frame, and another end portion extending and connected to the outer frame in the direction of the side of the island so that a region of a depressed portion is obtained.

REFERENCES:
patent: 4477827 (1984-10-01), Walker et al.
patent: 4514750 (1985-04-01), Adams
patent: 4916506 (1990-04-01), Gagnon

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