Lead frame for semiconductor device, and semiconductor device

Details Lead frame for semiconductor device, and semiconductor device Lead frame for semiconductor device, and semiconductor device

1999-01-07

2000-11-21

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257666, 257787, 257779, 257696, H01L 23495, H01L 2348

Patent

active

061507121

ABSTRACT:
Disclosed are a lead frame for a semiconductor device, and a semiconductor device using the lead frame. Inner leads and outer leads of the lead frame are formed to have such a sectional structure that a film of Pd or a Pd alloy is formed on both surfaces or a rear surface of a lead frame directly or through an undercoat, and an Au-plated film is formed on a part of the film of Pd or a Pd alloy. Pd and Au are not applied to unnecessary areas, thus resulting in higher economical and production efficiency. The lead frame has good quality, is economical and has superior productivity. Wires connecting a semiconductor chip and the inner leads have a good connection property and joint portions of the outer leads to an external device also have a good connection property.

REFERENCES:
patent: 4942454 (1990-07-01), Mori et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5455446 (1995-10-01), Suppelsa et al.
patent: 5616953 (1997-04-01), King et al.
patent: 5994767 (1999-11-01), Huang et al.

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