Lead frame for semiconductor device and process for producing th

Details Lead frame for semiconductor device and process for producing th Lead frame for semiconductor device and process for producing th

1997-11-10

1998-09-01

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257736, 257766, 257666, 438123, H01L 2348, H01L 2352, H01L 2940

Patent

active

058014365

ABSTRACT:
The present invention relates to a lead frame for the formation of a frame structure of an integrated circuit, more particularly, to a lead frame, having a structure possessing excellent bondability, solder wettability, and Ag paste adhesion. A lead frame for a semiconductor device comprises a lead frame material; a Pd plating or a Pd alloy plating, provided on the lead frame material; and a layer as an uppermost layer formed of a Pd oxide and gold or silver. A process for producing a lead frame for a semiconductor device comprises the steps of: plating a lead frame material with Pd or a Pd alloy; flasing the surface of the Pd or Pd alloy plating with gold (Au); and heat-treating the plated lead frame material in the air to provide a thin Pd oxide layer in only a Pd portion on the surface of a diffusion layer formed of Pd and Au.

REFERENCES:
patent: 3803708 (1974-04-01), Wada et al.
patent: 3818118 (1974-06-01), Bennett et al.
patent: 3933684 (1976-01-01), Petrow et al.
patent: 4410867 (1983-10-01), Arcidiacono et al.
patent: 4529667 (1985-07-01), Shiga et al.
patent: 5552031 (1996-09-01), Moon

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