Lead frame for semiconductor device

Details Lead frame for semiconductor device Lead frame for semiconductor device

1994-03-30

1995-06-13

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257672, 257667, H01L 2348, H01L 2350

Patent

active

054245770

ABSTRACT:
A lead frame for semiconductor devices which does not require tie bar cutting in the manufacture of semiconductor devices includes a base lead frame having no tie bars and a dummy lead frame having dummy leads filling gaps between outer lead portions of the leads when the dummy lead frame is mounted on the base lead frame. Instead of tie bars, the dummy leads reinforce the leads and also stop molten sealing resin from flowing into the gaps between the outer lead portions during resin molding.

REFERENCES:
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5014113 (1991-05-01), Casto
patent: 5221859 (1993-06-01), Kobayashi et al.

Affiliated with

Also associated with

Rating

Lead frame for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1311530