1989-09-07
1991-06-04
Hille, Rolf
357 68, H01L 2348, H01L 2312
Patent
active
050218654
ABSTRACT:
A lead frame of a package cast from mold resin is composed of a die bond pad section on which a semiconductor chip is placed and connected to a plurality of leads placed around the die bond pad section. The die bond pad section is formed of a length of an elongated material of a reduced width, i.e., having a line-like form disposed as a pattern in the form of a Peano curve. The die bond pad section has one or a plurality of such supporting sections integrally connected to and supported by one or more extension lead or leads. The die bond pad section formed by the elongated material has a low stiffness, and thus serves to prevent cracks from being formed in the package or in the semiconductor ship due to thermal contraction effects.
REFERENCES:
patent: 4258381 (1981-03-01), Inaba
patent: 4797726 (1989-01-01), Manabe
patent: 4918511 (1990-04-01), Brown
patent: 4952999 (1990-08-01), Robinson et al.
Osaka Shuichi
Takahashi Yoshiharu
Clark S. V.
Hille Rolf
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Lead frame for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead frame for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1030429