Lead frame for semiconductor device

Details Lead frame for semiconductor device Lead frame for semiconductor device

1997-03-25

1999-09-28

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428620, 428670, 428672, 428674, 428929, 257666, 257677, H01L 23495, B32B 1520

Patent

active

059586079

ABSTRACT:
A lead frame has a metal substrate directly coated with a palladium alloy layer to prevent diffusion of metal molecules from the metal substrate. The lead frame does not contain a nickel intermediate layer, thereby preventing the diffusion of nickel molecules which makes soldering difficult, and enhancing production.

REFERENCES:
patent: 4699697 (1987-10-01), Higuchi
patent: 4985310 (1991-01-01), Agarwala et al.
patent: 5510197 (1996-04-01), Takahashi et al.
patent: 5618576 (1997-04-01), Baek
patent: 5684329 (1997-11-01), Serizawa
patent: 5750016 (1998-05-01), Moon
patent: 5767574 (1998-06-01), Kim et al.

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