Lead frame for resin sealed semiconductor device

Details Lead frame for resin sealed semiconductor device Lead frame for resin sealed semiconductor device

2005-06-28

2005-06-28

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S669000, C257S787000

Reexamination Certificate

active

06911719

ABSTRACT:
A molding equipment for a resin shielding semiconductor device includes a lower platen having a lower cavity, and an upper platen having an upper cavity, and a recess which is adjacent to the upper cavity. A lead frame has an opening serving as a passage of resin. The opening has one end rounded.

REFERENCES:
patent: 5275546 (1994-01-01), Fierkens
patent: 5326243 (1994-07-01), Fierkens
patent: 5349136 (1994-09-01), Abe et al.
patent: 5635220 (1997-06-01), Izumi et al.
patent: 5684327 (1997-11-01), Nakazawa et al.

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