Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-07-14
1999-07-27
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257667, 257676, 257698, 257758, 257762, 257766, H01L 2348, H01L 2944
Patent
active
059295112
ABSTRACT:
A lead frame is made from a body including a Cu layer and stacked plate layers including an Ni layer, a Pd layer and an Au layer formed on the body. The lead frame includes a die pad, die-pad supports, inner leads, dam-bars, outer leads and an outer frame. No Au layer is formed in a gate runner portion. Since the Pd layer with poor adhesion to a sealing resin is exposed in the gate runner portion, the sealing resin remaining in the gate runner portion can be easily removed by punching pilot holes from the rear side after completing a resin sealing procedure. Thus, the lead frame can be definitely prevented from being deformed without providing any additional element.
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02232957; Abstract of Japan "Lead Frame of Resin Seated Semiconductor Device" Yorchi, Mar. 1989.
040250314; Abstract of Japan "Lead Frame for Semiconductor Device" Yorchi, May 1990.
Aiba Tadahiko
Ikeda Takashi
Iwasaki Tomohiko
Nakazawa Eiichi
Yoshida Shigeo
Matsushita Electronics Corporation
Williams Alexander Oscar
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