Lead frame for molded integrated circuit package

Details Lead frame for molded integrated circuit package Lead frame for molded integrated circuit package

1982-09-03

1985-01-01

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29827, 357 70, 357 72, 26427211, H01L 2328, H01L 2348

Patent

active

044909020

ABSTRACT:
A lead frame for a molded semiconductor device package. The lead frame has a pattern of finger leads with convergent free inner ends and dam bars between adjacent finger leads. The dam bars are partially severed from their contiguous finger leads due to cuts on their edges intended to face a body member molded over the finger lead inner ends. The partially severed dam bar edge is preferably positioned to be substantially at the periphery of the molded body member. The resultant molded body member can thus have a finished surface even between the finger leads as molded and dam bar cutting die wear reduced.

REFERENCES:
patent: 3574815 (1971-04-01), Segerson
patent: 3611061 (1971-10-01), Segerson
patent: 4109096 (1978-08-01), Dehaine
patent: 4214364 (1980-07-01), St. Louis et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4374080 (1983-02-01), Schroeder
patent: 4449690 (1984-05-01), Schroeder

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