Lead-frame for manufacturing semiconductor devices

Details Lead-frame for manufacturing semiconductor devices Lead-frame for manufacturing semiconductor devices

1991-07-11

1993-05-04

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, H01L 2328

Patent

active

052084817

ABSTRACT:
A leadframe facilitates the bonding of leads to semiconductor chips. The leadframe has two longitudinal bands transversely spaced from each other, and connected by bar-like segments initially non-perpendicular to the bands, and spaced longitudinally along the leadframe. The leadframe also includes leads projecting from both of the bands, the leads projecting from one band being interleaved with those projecting from the other band. When one moves the longitudinal bands relative to each other longitudinally, the leads projecting from the first band come into alignment with the leads projecting from the second band. Thus, if one has first bonded semiconductor chips to the ends of the leads projecting from the first band, then movement of the bands longitudinally makes it easy to connect the second leads to each of the semiconductor chips.

REFERENCES:
patent: 3430115 (1969-02-01), Webb
patent: 3839782 (1974-10-01), Lincoln
patent: 3864820 (1975-02-01), Brenan et al.
patent: 4616250 (1986-10-01), Folk
patent: 5060117 (1991-10-01), Dorlanne et al.

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