Lead frame for leaded semiconductor chip carriers

Details Lead frame for leaded semiconductor chip carriers Lead frame for leaded semiconductor chip carriers

1983-08-26

1984-10-16

James, Andrew J.

357 68, 357 72, H01L 2348, H01L 2944, H01L 2328

Patent

active

044778279

ABSTRACT:
A lead frame with parallel side members and parallel transverse members defining chip receiving areas along the frame, has a chip pad at each area. A support lead extends from each corner of the chip pad to corresponding conjunctions of side and transverse members. A U-shaped support bar extends between each adjacent pair of support leads, each support bar including spaced parallel leg portions connected at inner ends to the support leads and at the outer ends by a lead support portion. Leads extend from each lead support portion towards the chip pad. By this means the chip can be assembled to the pad and wire bonding between chip and leads carried out and the leads can be preformed or not, as desired, prior to encapsulation. After encapsulation, the lead support portions can be trimmed off but the encapsulated device is still held in the lead frame but the leads are electrically isolated from each other. Testing can be carried out while devices are still in the lead frame.

REFERENCES:
patent: 4214364 (1980-07-01), St. Louis et al.
patent: 4301464 (1981-11-01), Otsuki et al.

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