Lead frame for integrated circuits and process of packaging

Details Lead frame for integrated circuits and process of packaging Lead frame for integrated circuits and process of packaging

1998-01-23

1999-11-30

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438124, 438126, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

059941693

ABSTRACT:
A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).

REFERENCES:
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5432127 (1995-07-01), Lamson et al.
patent: 5776801 (1998-07-01), Carper et al.

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