Lead frame for integrated circuit devices

Details Lead frame for integrated circuit devices Lead frame for integrated circuit devices

1981-08-17

1983-11-15

Edlow, Martin H.

357 68, 29827, H01L 2960, H01L 2348

Patent

active

044159170

ABSTRACT:
A lead frame for an IC device includes a body element located at its center, the body element including recesses in its outer periphery in which the inner tips of the leads of the lead frame are fitted at predetermined positions. With such an arrangement, the leads are prevented from being deformed during steps of formation of the IC device.

REFERENCES:
patent: 3781457 (1973-12-01), McKerreghen
patent: 3802069 (1974-04-01), Thompson
patent: 4137546 (1979-01-01), Frusco
patent: 4138691 (1979-02-01), Bonkohara et al.

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